Packaging for bare dice employing EMR-sensitive adhesives

ABSTRACT

A structure and method for protecting semiconductor integrated microcircuit dice during shipping. The structure secures the position of the die or dice atop an EMR-penetrable element using an adhesive layer, the stickiness, adhesiveness or coefficient of friction of which is alterable by exposure to EMR of a predetermined wavelength range, such as ultraviolet light. Once the structure reaches its destination, prior to removal of the dice, the adhesive layer is exposed to EMR, such as ultraviolet light, through the element. This exposure reduces the stickiness, adhesiveness, or coefficient of friction of the adhesive to facilitate die removal. The EMR-sensitive adhesive does not leave contaminating silicon residue on the removed die. The invention may be realized using currently commercially available UV tape and modified die-pac designs having UV light penetrable die transport portions, or tape-and-reel type die transport structures.

CROSS REFERENCE TO RELATED APPLICATION

This application is a divisional of U.S. application Ser. No.08/884,902, filed Jun. 30, 1997, which is a continuation-in-part of U.S.application Ser. No. 08/659,268, filed Jun. 6, 1996, now U.S. Pat. No.5,775,510, which is a continuation of U.S. application Ser. No.08/368,516, filed Jan. 4, 1995, now U.S. Pat. No. 5,590,787.

BACKGROUND OF THE INVENTION

1. Field of the Invention

This invention relates to semiconductor integrated microcircuitmanufacturing and more particularly to temporarily packaging singulatedintegrated circuit dice for shipping.

2. State of the Art

Semiconductor integrated circuit chips are typically constructed enmasse on a single wafer or other substrate of silicon or othersemiconductor material. After the circuits are created, the wafers orsubstrates are split up, or "singulated," into individual integratedcircuit chips or dice. Typically, each die is then individuallyencapsulated into integrated circuit packages which are capable of beingattached to printed circuit boards. However, dice are often sold ortransferred to other manufacturing sites in the unpackaged form. Theunpackaged dice must therefore be shipped through the mail or by otherfreight means to destinations which can be cities, states or evencountries apart. Freight travel often involves subjecting articles sotransported to a harsh, contaminant-laden environment in terms of dirtand dust, as well as mechanical shock and vibration. This environmentrequires that the dice be temporarily packaged to protect them from suchexposure.

Over the years, the industry has developed packages called die-pacswhich temporarily contain the dice during shipping. Currently, die-pacsare protective containers similar to that shown in FIG. 1. Thecontainers are made of black conductive polypropylene to keep out dustand other contaminants and to protect the die from static charges andfrom crushing and impact type forces caused by rough handling. Thecontainer comprises a lower bed structure 1 which is capable of beingmated to a cover structure 2. When mated, an inner cavity 3 is formedfor storing the die 4 or dice. The bed and cover are held togetherthrough temporary securing means such as interlocking clasp brackets 5and 6. The position of the die within the cavity of the container issecured by a layer of silicone gel adhesive material 7 contacting theundersurface of the die and a surface of the bed facing the innercavity.

The silicone gel is similar to common household cellophane wrappingmaterial. However, silicone gel has greater resiliency and will not holda static electric charge of any significance.

Prior to shipping, the singulated dice are placed atop the silicone gellayer on the bed through robot deposit or other means. The cover is thenmated and secured to the bed using the interlocking clasp brackets. Thedie-pac is then ready for shipment.

Upon arrival of the die-pac at its destination, the interlocking claspbrackets are removed and the cover lifted from the bed. Robot-operatedpickup means then remove the die or dice from the bed.

There are, however, certain problems which have arisen using the popularsilicone gel die-pac. First, the adhesive nature of the silicone gel,which is strong enough to maintain the position of the die duringtransport, requires either expensive manual removal of the dice or thatthe robot pickup means be sufficiently strong to remove the die from thegel. This relatively powerful pickup means sometimes can damage thesensitive die during the pickup operation. When less strong means areused, there are often many unsuccessful attempts made before the die ispicked-up. Repetitive attempts to pick-up a die increases theprobability of damaging the die during the pick-up process.

Second, it has been found that residue from the silicone gel oftencontaminates portions of the dim. This residue is in the form of siliconcompounds such as silicon oxides and silicon-metal compounds. Tests haveshown particularly high concentrations of compounds such aspolydimethylsiloxane (CH₃ --(Si--O)_(n) --CH₃). These compoundsgenerally contaminate the surfaces of a die, resulting most commonly inreduced conductivity of the die's electrical contact points, therebyforcing further costly processing prior to packaging. Severecontamination will even cause a die to be non-functional.

Therefore, it would be valuable to have a method for shipping singulateddice which does not subject the dice to the problems associated with theprior art packaging techniques as referenced above.

BRIEF SUMMARY OF THE INVENTION

The present invention provides packaging and methods for inexpensivelyprotecting singulated dice during shipping from contamination anddamage, as well as facilitating removal of the singulated dice frompackaging upon reaching their destination.

The invention may utilize current die-pac structural designs so as tominimally impact the current automation devices for loading and removingdice from shipping die-pacs, although the invention is not so limited,as set forth in greater detail below.

The invention provides a die-pac which allows less powerful means forremoving the dice from the die-pac after it has reached its destination.

These and other advantages are achieved by a structure having anultraviolet (UV) light or other electromagnetic radiation (EMR)transmissive or penetrable plate upon which has been placed a layer ofUV light or other EMR-sensitive adhesive for securing the position ofthe die or dice during shipping. The adhesive is sensitive to selected,predetermined wavelengths of EMR in that its adhesiveness, stickiness orcoefficient of friction is alterable by exposing the adhesive to suchselected wavelengths of EMR, such as UV light. Upon arrival of thestructure at its destination, the adhesive is subjected to an EMR sourceemitting such radiation within the selected wavelengths, therebyreducing its adhesiveness, and allowing for less powerful pickup of thedice during removal. The specific adhesive used as disclosed hereinprovides less harmful silicon residues to the dice during shipping.

The structure of the invention is readily adaptable to current die-pacdesigns having a matable bed and cover for enclosing the die or dice forprotection during shipping. Such die-pac designs may be simplified inconstruction in comparison to current die-pacs to provide lessexpensive, while still adequate, protection for the bare dice undertransport.

Further, it is also contemplated that the present invention may beembodied in the form of a tape-and-reel transport system for bare dice.

BRIEF DESCRIPTION OF THE SEVERAL VIEWS OF THE DRAWING

FIG. 1 is a perspective cut-away view of a prior art die-pac usingsilicone gel adhesive as the die-securing means;

FIG. 2 is a perspective view of a die holding bed according to theinvention;

FIG. 3 is a cross-sectional end view of the die holding bed of FIG. 2;

FIG. 4 is a cross-sectional end view of a vessel structure capable ofcontaining one or more die holding beds during shipping;

FIG. 5 is a cross-sectional end view of a die-pac according to theinvention;

FIG. 5A is a cross-sectional end view of a die-pac similar to that ofFIG. 5, but having a simplified structure;

FIG. 6 is a cross-sectional end view of an alternate embodiment of adie-pac constructed according to the invention having a nylon webinterposed between the tape and the bed surface;

FIG. 7 is a cross-sectional end view of an alternate embodiment of adie-pac constructed according to the invention showing multiple dice anda bed portion made completely of EMR-transmissive material;

FIG. 8 is t block diagram of the steps necessary for shipping singulateddice packaged in die-pacs according to the invention;

FIG. 9 is a side, partial sectional view of a simplified die supportstructure for a die-pac;

FIG. 10 is a top view of the simplified die support structure of FIG. 9;

FIG. 11 is, a schematic side sectional elevation of a tape-and-reel dietransport assembly and associated EMR chamber according to theinvention;

FIGS. 12A and 12B are schematic top views of two die-support tapes ofdifferent design employing EMR-sensitive adhesives in differentpatterns;

FIG. 13 is an enlarged side sectional view of a die-support tapeincluding die containment cavities; and

FIG. 14 is a transverse cross-sectional view of a die-support tapedefining a continuous channel for receiving dice therein.

DETAILED DESCRIPTION OF THE INVENTION

Referring now to the drawing, FIGS. 2 and 3 respectively show aperspective view and a cross-sectional end view of a structure accordingto the invention for releasably holding a microcircuit die. Thestructure comprises a bed structure 10 made of substantially rigidconductive material such as black conductive polypropylene. A portion ofthe bed forms a plate 11 made of material which is penetrable by (i.e.,transmits) ultraviolet (UV) light, such as substantially clear plastic,glass or polycarbonate. The plate 11 has an upper face 12 and a lowerface 13. The position of the die 14 is secured above a section 16 of theplate by a layer of ultraviolet light sensitive adhesive 15 contactingthe undersurface 17 of the die.

Upon arrival of the holding structure at its destination, the lower face13 of the plate portion of the bed is subjected to UV light ofsufficient intensity. The light penetrates through the plate and intothe UV light-sensitive adhesive layer existing between the die and theupper face of the plate. This exposure reduces the coefficient offriction of the adhesive. The die can then be easily removed throughvacuum pick-up means.

FIG. 4 shows that one or more of the holding beds may be loaded into avessel structure 18 to further protect the die 14 or dice from theshipping environment, which may include dust, heat, shock, vibration andstatic charges. The structure comprises at least one cavity 19 capableof enclosing a die or dice, and means for securing the position of thedie or dice within the cavity. In this case, the vessel may contain aplurality of holding beds 20. The means for securing comprise a pair ofparallel grooves 21, 22 for each holding bed to be loaded into thevessel. Each pair of grooves is set into the inner surface 23, 24 ofparallel walls 25, 26 of the vessel. The grooves are sized anddimensioned to releasably engage opposite ends 27, 28 of a holding bed.Upon arrival of the vessel at its destination, the vessel may be openedand the holding beds removed to be irradiated.

An alternate embodiment of the invention is directed towardimplementation of the invention using the typical, currently useddie-pac structure. FIG. 5 shows a cross-sectional end view of a typicaldie-pac structure. The die-pac is a container which comprises a lowerbed structure 30 which is capable of being mated to a cover structure31. The cover and the bed are made of protective, hard, conductivematerial such as black conductive polypropylene. Once mated, an innercavity 32 is formed between the bed and cover. The cavity is sized anddimensioned to contain the die 33 therein. The bed and cover are heldtogether through temporary securing means such as interlocking claspbrackets 34 which engage the edge flanges 35, 36 of the mated bed andcover.

The position of the die within the cavity of the container is held by alayer of ultraviolet light-sensitive adhesive 37 contacting theundersurface 38 of the die and secured over the upper face 39 of a plateportion 40 of the bed structure 30. As in the previous embodiment, theplate portion 40 is made of UV light-penetrable material such astransparent plastic, glass, or polycarbonate.

In this embodiment, the adhesive layer is formed using ultravioletsensitive tape (UV tape) of the type which is currently used to hold ICwafers firmly in place during the singulation process. UV tape typicallycomprises a layer of ultraviolet curable, pressure sensitive adhesive 37such as acrylic attached to a UV-penetrable polyvinyl chloride backing41. The backing 41 has an undersurface 42 which is secured above theupper face 39 of the plate 40 and a top surface 43 which carries theUV-sensitive adhesive 37. The undersurface 42 may be secured directly tothe upper face 39 using any number of means available in the art such asepoxy. However, the means used must not substantially interfere with thepenetration of UV light through the plate portion 40 and onto theUV-sensitive adhesive 37. Alternatively, as shown in FIG. 5A, plateportion 40 may be eliminated from the bed structure 30 and an aperture140 employed instead, backing 41 then comprising a more robust orthicker material (such as a thicker tape) bonded at its edges 142 overaperture 140 using adhesives, heat, ultrasound or other techniques knownin the art.

UV tape is currently available from suppliers such as Kanematsu USA,Inc., of New York, N.Y. under the brand name Furukawa UV Tape; UniglobeKisco Co., of Santa Clara, Calif., under the brand name Bando DicingTape; and others. Although UV-sensitive adhesive tape is the preferredadhesive, other EMR-sensitive adhesives such as glues and gels may beused in place of the UV tape without departing from the invention.

FIG. 6 shows an alternate embodiment of the invention wherein a layer ofwebbing material 44 has been interposed between a UV-sensitive adhesivelayer 45 and a UV-penetrable plate portion 46 of a support bed 47. Thewebbing further protects the die 48 from mechanical shock. The webbingmust either be made from UV transparent material or woven coarse enoughto allow UV light to pass through to the tape. The webbing is preferablymade of nylon.

FIG. 7 shows an alternate embodiment of the invention wherein differentmeans are used to attach a die-pac cover 49 to a bed structure 50. Hereis shown a hinged connection 51 between the bed and cover which can besnapped closed using a common prong/detent snap mechanism 52. Thisembodiment is included to show that many well-known means for releasablyenclosing dice may be used without departing from the invention.

This embodiment further shows that more than one die 53, 54 and 55 maybe placed within the cavity 56 formed between the cover and bed of thedie-pac. The UV-penetrable plate portion 57 of the bed is shownextending across the length of the cavity. This is not required. Allthat is required is that sections 58, 59 and 60 of the bed locatedbeneath the dice be capable of passing UV light and allowing theadhesive layer to be exposed.

In general, any means for containing the dice may be used withoutdeparting from the invention so long as those means allow for thepenetration of electromagnetic radiation which will reduce thecoefficient of friction of the adhesive layer.

As stated above, all of the structure below the adhesive layer must bepenetrable by the UV light, including the UV tape backing. When webbingis used, it must be penetrable. In this respect, the structure below theadhesive layer may be referred to collectively as the EMR-penetrable"plate" portion.

The pre-exposure stickiness, level of adhesion or coefficient offriction of the UV-sensitive adhesive should generally be strong enoughto securely hold the dice during the rigors of shipping, and be weakenough after exposure and curing to allow for vacuum pick-up. Theadhesive should not contain a significant concentration of anyundesirable compounds which would result in contamination of the die ordice.

X-ray photoelectron spectroscopy (XPS) tests performed on dice exposedto an amount of silicone gel and dice exposed to a comparable amount ofUV tape reveal generally that the UV tape exhibits about one half theamount of contamination of silicone gel.

Although UV light is used in the preferred embodiment, other types ofelectromagnetic radiation may be used so long as the plate portion ispenetrable by it, and the adhesive layer is sensitive to it. For thecommercially available UV-sensitive adhesive tape disclosed above andfor most clear plastic, glass or polycarbonate, UV light having awavelength of between 250 and 350 nanometers has been found to beadequate. UV sensitive adhesives by different manufacturers areresponsive to different but largely overlapping wavelength ranges, andthe invention may thus be practiced effectively with such differentadhesives using a wide-spectrum UV source.

FIG. 8 shows exemplary process steps for transporting or shipping asingulated die according to the invention. The process begins withplacing 61 the die on an unexposed UV-sensitive layer of adhesive suchas UV tape attached to the upper surface of a substantially transparentportion of a bed. The term "substantially transparent" in thisspecification means that the portion is capable of passing through UVlight with a satisfactorily low amount of attenuation. The next stepinvolves enclosing 62 the die within the die-pac and sending 63 thedie-pac to its destination. During transport, the die-pac should not beirradiated by any UV light source. This is usually accomplished byplacing the die-pac within an opaque antistatic bag. Upon arrival, thereare the steps of: exposing 64 a portion of the tape existing between thedie and the substantially transparent portion of the bed toelectromagnetic radiation in the form of ultraviolet light; opening 65the die-pac; and removing 66 the die from the die-pac. The exposing stepmay occur prior to or after the opening step of the die-pac.

Referring now to FIGS. 9 and 10 of the invention, shown is a simplifieddie support structure 100 usable with the vessel structure 18 of FIG. 4or as part of a die-pac as illustrated in FIGS. 5, 5A and 6 of thedrawings, in lieu of the structures employed therein. Die supportstructure 100 includes an outer, self-supporting rectangular frame 102of a material such as black conductive polypropylene, within which issupported a carrier sheet or film 104 of a suitable EMR-penetrablematerial such as polyvinyl chloride (UV-penetrable) bearing anEMR-sensitive adhesive 106 such as acrylic on at least portions of itsupper surface 108. As depicted, die support structure 100 carries fourdice 110, adhered to carrier sheet or film 104 by four "dots" 112 ofadhesive 106. As an alternative to a completely EMR-penetrable material,sheet or film 104 may comprise an EMR-opaque material patterned withEMR-penetrable inserts such as tape segments applied over apertures inthe EMR-opaque material (see also FIG. 5A), or EMR-penetrable segmentsformed integrally with the EMR-opaque material.

The carrier sheet or film 104 may be stretched taut, and thereafterupper frame member 120 placed thereover in alignment with mating lowerframe member 122, the two members 120 and 122 thereafter "snapped"together to maintain carrier sheet or film 104 in its stretched statefor support of dice 110. Excess carrier material may then be trimmedfrom the exterior of frame 102, or a sharp edge, such as 124, formed onone of upper and lower frame members 120 or 122 to sever carrier sheetor film 104 from a larger segment. If desired, the carrier sheet or film104 may be formed with a supporting webbing 126 similar to webbing 44 ofthe embodiment of FIG. 6. The webbing 126, shown in broken lines in FIG.9, may optionally be incorporated within the predominant material ofsheet or film 104, or lie above or below it and preferably adheredthereto. Such webbing 126 may assist in maintaining the carrier sheet orfilm 104 in a taut state during transport and consequent exposure totemperature extremes. Flanges 130 extending from opposing sides of frame1021 may be mated to a cover structure such as 31 (FIG. 5), frame 102and cover structure 31 then being locked together with clasp brackets 34or other suitable clamping elements, as previously disclosed withrespect to other embodiments.

FIG. 11 depicts yet another embodiment of the invention, in thisinstance a tape-and-reel transport assembly 200, herein illustrated withreel 202 feeding a continuous carrier tape 204 bearing a plurality ofbare dice 206 secured by EMR-sensitive adhesive segments 208 overEMR-penetrable windows 210 (elements 206, 208 and 210 shown enlarged forclarity) in carrier tape 204 into an EMR chamber 220 to effect releaseof the dice 206 through sequential exposure to an EMR source 222 withinchamber 220. EMR source 222 is preferably placed below and aimedupwardly through carrier tape 204 as it passes through EMR chamber 220.EMR source 222 may be continuously activated, intermittently activatedresponsive to the presence of a carrier tape-adhered bare die thereover,or continuously activated but shielded by a shutter structure until suchtime as a carrier tape-adhered bare die is disposed thereover. Reel 202carrying a tape 204 bearing dice 206 adhered thereto and wound aroundreel 202 would typically be disposed for transport in a case 300 asknown in the art, or at least in an EMR-opaque antistatic bag 302 (bothshown in reduced size in FIG. 11). As with the previously-describedembodiments, the current best mode of practicing this embodiment employsUV-sensitive adhesives and a UV EMR source.

FIGS. 12A and 12B depict several variations in the structure of carriertape 204 according to the invention. FIG. 12A illustrates a carrier tape204a having indexing holes 240 at equal intervals along each lateraledge thereof for precise, controlled movement of tape 204a by indexingpins or sprockets as known in the art, such feature being conventional.As tape handling equipment for TAB (tape automated bonding) operationsis conventionally most often designed to handle either 35 mm or 70 mmwide tape (depending upon packaged die size), it is contemplated,although not required, that the present invention might be practicedwith tapes of those widths so as to facilitate use of existingequipment. Tape 204a may be substantially comprised of a flexible,EMR-opaque metallic or non-metallic (such as synthetic resin) material,and includes EMR-transmissive segments 242 formed therein or placed overapertures formed therein at die placement locations 244. Segments 242carry an EMR-sensitive adhesive patch 246 on their upper, or carrier,surfaces. Dice 206 are then placed on adhesive patches 246, adheringthereto until they are subsequently released by selective EMR exposure,as previously described. After adherence of dice 206, tape 204a is thenwound about a reel 202 for transport, reel 202 then being typicallyplaced in reel case 300 or an EMR-opaque anti-static bag 302. Segments242 and adhesive patches 246 may be embodied in several ways. Forexample, segment 242 may comprise an adhesive-coated tape as previouslymentioned. Alternatively, adhesive 246 may comprise dots, crosses or X'sof adhesive applied through a stencil or by a printing head, or sprayed,onto segments 242.

FIG. 12B depicts a carrier tape 204b comprised of two robust, mutuallyparallel edge strips 260 containing indexing holes 240, with acontinuous intervening die support strip 262 of EMR-transmissivematerial disposed therebetween. The entire tape 204b or only die supportstrip 262 may be formed of EMR-transmissive material, as desired orrequired. The edge strips 260 may be of greater thickness than diesupport strip 262 to eliminate stretching of tape 204b, and tofacilitate the use of a thinner, and thus more EMR-transmissive segmentfor die support strip 262. Further, edge strips 260 may extend above theupper surface of support strip 262 so as to provide a recessed channelfor containing and protecting dice 206 when tape 204b is wound on reel202. If desired, transversely-extending brace members 263 may extendbetween edge strips 260 to stabilize the die support areas and reducethe tendency of carrier tape 204b to flex when the dice adhered theretoare retrieved. An EMR-sensitive adhesive may be applied to die supportstrip 262 in the manner described with respect to FIG. 12A, or, asdepicted, may comprise a single continuous adhesive strip 264 or twomutually parallel adhesive strips 266 (shown in broken lines).

FIG. 13 depicts an enlarged side sectional view of a segment of a tape204c, depicting die containment cavities 270 having EMR-penetrablebottoms 272 for carrying and enclosing dice 206 adhered to EMR-sensitiveadhesive material 274. When wound on a reel 202, cavities 270 willprotect dice 206 on tape 204c against damage and contamination. Itshould be noted that prior art tape structures employing cavitiestypically require a lid or shutter over the mouth of each cavity toprevent the enclosed die from falling out, which requirement iseliminated by the present invention.

FIG. 14 depicts a transverse cross-sectional view of a tape 204d definedby a central channel-shaped member 280, at least the bottom 282 of whichis comprised in whole or in segments of an EMR-transmissive material.Longitudinally-spaced dots or segments or a continuous strip or stripsof EMR-sensitive adhesive material 284 are applied to bottom 282 insidechannel shaped member 280. Dice 206 are carried on adhesive material284, protected within the confines of channel-shaped member 280. Lateralflanges 286 extend transversely to tape 204d along the length thereof,and may be placed at the upper, midportion or lower extents of thechannel sidewalls 288 as shown in broken lines. Flanges 286 may includeapertures for engagement by tape-handling mechanisms.

While the preferred embodiments of the invention have been described,additions, deletions and modifications may be made to those illustrated,features of different embodiments combined, and other embodimentsdevised, without departing from the spirit of the invention and thescope of the appended claims.

What is claimed is:
 1. A die support structure, comprising:aself-supporting frame defining a periphery of said die supportstructure; a sheet of material secured within said frame, at least aportion of said sheet including a segment penetrable by a predeterminedwavelength range of EMR; a quantity of adhesive disposed over saidsegment, said adhesive having a coefficient of friction alterable byexposure to EMR within said predetermined wavelength range; and a coversecured to said frame and extending over said sheet and said quantity ofadhesive.
 2. The structure of claim 1, wherein said EMR is light, andsaid segment is formed of material substantially transparent to light.3. The structure of claim 2, wherein said light comprises ultravioletlight.
 4. The structure of claim 3, wherein said ultraviolet light has awavelength of between 250 and 350 nanometers.
 5. The structure of claim1, wherein said segment comprises a length of tape disposed over anaperture formed in said sheet, having an undersurface secured to saidsheet and a upper surface carrying said quantity of adhesive.
 6. Thestructure of claim 1, wherein said sheet further comprises a layer ofresilient webbing penetrable by said predetermined wavelength range ofEMR.
 7. The structure of claim 6, wherein said layer of resilientwebbing comprises nylon.
 8. A die support structure, comprising:a bedhaving an aperture therethrough; a backing penetrable by EMR within apredetermined wavelength range disposed over said aperture and securedto said bed proximate said aperture; a quantity of adhesive disposed onsaid backing, said adhesive having a coefficient of friction alterableby exposure to EMR within said predetermined wavelength range; and acover secured to said bed and extending over said backing and saidquantity of adhesive.
 9. The structure of claim 8, wherein said EMR islight.
 10. The structure of claim 9 wherein said light comprisesultraviolet light.
 11. The structure of claim 10, wherein saidultraviolet light has a wavelength of between 250 and 350 nanometers.12. The structure of claim 8, wherein said aperture is covered by alayer of resilient webbing penetrable by said predetermined wavelengthrange of EMR.
 13. The structure of claim 12, wherein said layer ofresilient webbing comprises nylon.
 14. A die support structure,comprising:an elongated carrier tape structure of a configurationsuitable for winding on a reel, at least a plurality oflongitudinally-spaced portions of said elongated carrier tape structurebeing penetrable by EMR within a predetermined wavelength range; and aquantity or adhesive disposed over at least some of said at least aplurality of said longitudinally-spaced elongated carrier tape structureportions, said adhesive exhibiting a coefficient of friction alterableby exposure to EMR within said predetermined wavelength range.
 15. Thedie support structure of claim 14, wherein a substantially continuousportion of said elongated carrier tape structure is penetrable by saidEMR within said predetermined wavelength range.
 16. The die supportstructure of claim 14, wherein said quantity of adhesive comprises atleast one adhesive strip substantially coextensive with said carriertape structure.
 17. The die support structure of claim 16, wherein saidat least one adhesive strip comprises at least two mutually paralleladhesive strips.
 18. The die support structure of claim 14, furtherincluding a plurality of longitudinally-spaced indexing aperturesextending along sides of said carrier tape structure.
 19. The diesupport structure of claim 14, further comprising a reel, said elongatedcarrier tape structure being wound therearound.
 20. The die supportstructure of claim 19, further including a container within which saidreel and said carrier tape structure are disposed.
 21. The die supportstructure of claim 20, further including a plurality of dice adhered tosaid carrier tape structure.
 22. The die support structure of claim 14,wherein said elongated carrier tape structure includes cavities havingsaid EMR-penetrable portions at bottoms thereof, said adhesive beingdisposed on said cavity bottoms.
 23. The die support structure of claim14, wherein said elongated carrier tape structure includes alongitudinally-extending channel defined by two sidewalls and a bottom,at least portions of said bottom being formed of EMR-penetrablematerial.
 24. The structure of claim 14, wherein said EMR is light. 25.The structure of claim 24, wherein said light comprises ultravioletlight.
 26. The structure of claim 25, wherein said ultraviolet light hasa wavelength of between 250 and 350 nanometers.
 27. A die supportstructure, comprising:a self-supporting frame defining a periphery ofsaid die support structure; a sheet of material secured within saidframe, at least a portion of said sheet including a segment penetrableby a predetermined wavelength range of EMR; a quantity of adhesivedisposed over said segment, said adhesive having an adhesivenessalterable by exposure to EMR within said predetermined wavelength range;and a cover secured to said frame and extending over said sheet and saidquantity of adhesive.
 28. A die support structure, comprising:a bedhaving an aperture therethrough; a backing penetrable by EMR within apredetermined wavelength range disposed over said aperture and securedto said bed proximate said aperture; a quantity of adhesive disposed onsaid backing, said adhesive having an adhesiveness alterable by exposureto EMR within said predetermined wavelength range; and a cover securedto said bed and extending over said backing and said quantity ofadhesive.
 29. A die support structure, comprising:an elongated carriertape structure of a configuration suitable for winding on a reel, atleast a plurality of longitudinally-spaced portions of said elongatedcarrier tape structure being penetrable by EMR within a predeterminedwavelength range; and a quantity of adhesive disposed over at least someof said at least a plurality of said longitudinally-spaced elongatedcarrier tape structure portions, said adhesive exhibiting anadhesiveness alterable by exposure to EMR within said predeterminedwavelength range.